For the past five years, Cooler Master's engineers have been hard at work tinkering and toying with our patented Vapor Chamber technology in a bid to reinvent how heat-intensive components can be cooled. After countless trials and rigorous testing, we've seamlessly combined Horizontal Vapor Chambers with native heatpipes. The result? Superior air cooling that better protects your advanced components from overheating and damage.
So what are Vapor Chamber and 3DVC technologies? To put it simply, we've tossed out the traditional copper base that transfers heat away from the CPU and replaced it with a coolant filled VC. When these VCs are heated, the coolant transforms from liquid to gas and back again to protect your CPU from overheating. How? That's need to know info you'll need to head back to school (or the CM university) to comprehend.
All you need to know is that the process swiftly cools your hardware, and that in 3DVC, heatpipes and the horizontal base are seamlessly connected, helping to increase performance compared to conventional copper base air coolers.