Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Products specifications
|
Model Number
|
HTK-002-U1 |
|
Color
|
White |
|
Specific Gravity
|
2.37 |
|
Viscosity/Flowability
|
Nonflowing |
|
Thermal Conductivity
|
0.8 watts/meter- °C |
|
Volume Resistivity
|
5.0 x 1015 |
|
Dielectric Constant
|
4.4 at 100k Hz |
|
Dissipation Factor
|
0.02 at 100k Hz |
|
Dielectric Strength
|
550 volts/mil; 21.7 kV/mm |
Description
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Products specifications
|
Model Number
|
HTK-002-U1 |
|
Color
|
White |
|
Specific Gravity
|
2.37 |
|
Viscosity/Flowability
|
Nonflowing |
|
Thermal Conductivity
|
0.8 watts/meter- °C |
|
Volume Resistivity
|
5.0 x 1015 |
|
Dielectric Constant
|
4.4 at 100k Hz |
|
Dissipation Factor
|
0.02 at 100k Hz |
|
Dielectric Strength
|
550 volts/mil; 21.7 kV/mm |
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