HTK-002-U1 Thermal Compound

SKU: HTK-002-U1

$9.99

This Item will not be available for purchase until further notice due to our warehouse closing for the public health crisis.

Suitable for CPU, chipsets on Mainboard, VGA card, etc.
Easy to use.
Zif Socket Templates ensure correct applying area with various CPU socket types.
Produces an even layer when using applicator.
Wide range of application temperature.

Availability: In stock

Qty:

+ -

Overview
Specifications

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Products specifications

Model Number	HTK-002-U1 ;
Color	White ;
Specific Gravity	2.37 ;
Viscosity/Flowability	Nonflowing ;
Thermal Conductivity	0.8 watts/meter- °C ;
Volume Resistivity	5.0 x 1015 ;
Dielectric Constant	4.4 at 100k Hz ;
Dissipation Factor	0.02 at 100k Hz ;
Dielectric Strength	550 volts/mil; 21.7 kV/mm ;

Description

Products specifications

Model Number	HTK-002-U1 ;
Color	White ;
Specific Gravity	2.37 ;
Viscosity/Flowability	Nonflowing ;
Thermal Conductivity	0.8 watts/meter- °C ;
Volume Resistivity	5.0 x 1015 ;
Dielectric Constant	4.4 at 100k Hz ;
Dissipation Factor	0.02 at 100k Hz ;
Dielectric Strength	550 volts/mil; 21.7 kV/mm ;